21st Annual Components for Military & Space Electronics Conference & Exhibition Takes Place April 11-13

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Summary:

The CMSE 2017 training and exhibition will held at the Sheraton Four Points Hotel LAX in Los Angeles, CAApril 11-13 2017 organized by TJ Green Associates LLC.

Press Release:

26, January 2017: The CMSE Conference, Training and Exhibition promotes new technology and advancements in electronic components for use in military and space electronic systems. The DoD and NASA continue to emphasize the use of commercial electronics, where suitable, to drive down procurement and life cycle cost of military/aerospace systems. Many new components are only available as advanced PEMS and COTS. This conference focuses on how to successfully incorporate these new technologies into the harsh environments of military and space systems, which often require ten or twenty year mission life.

Two such thrust areas are copper wirebonding and the use of “non-hermetic” packaging in lieu of traditional hermetic packages. We have an entire session devoted to copper wire with peer selected talks from key industry experts. In addition to “non-hermetics” there are several presentations on the newly tightened MIL-STD-883 TM 1014 hermeticity test spec limits for class K hybrids and new leak testing technologies designed to meet tighter specs. A panel discussion is planned for this important topic of hermetic vs non-hermetic parts.

The latest developments in polymer tantalum capacitors, BME MLCC are presented along with success stories and challenges of COTS insertion will be a major point of discussion at this year’s conference, as it has in the past.

Day one is a full day of cutting edge educational seminars (dual track) designed to complement the speaker presentations scheduled on the following two days. These professional educational seminars are an important part of the CMSE tradition.

Topics covered:

* Hermeticity Testing, RGA and the New TM 1014 Spec Limits
* Multi-Layer Ceramic Capacitor Technology…Materials, Processes and Reliability Considerations
* Non-Hermetic Packaging for Hi-Rel Military and Aerospace
* Microelectronic Package & Board Failure Mechanisms and Related Analysis Techniques

For full program details and registration information visit www.TJGreenllc.com.

Phone: +1 (610) 625-2158